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Alternative part analysis

SPC560B50L1C6E0X replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for SPC560B50L1C6E0X, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
SPC560B50L1C6E0X

STMicroelectronics

Part NumberSPC560B50L1C6E0X
ManufacturerSTMicroelectronics
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
PackageLQFP
SeriesAutomotive, AEC-Q100, SPC56
Key Attributes-
DescriptionIC MCU 32BIT 512KB FLASH 64LQFP
Lifecycle-
Stock34,880
Available17,717
Min Order1
DatasheetRequest
Supply Voltage-Max (Vsup)3.6V
Oscillator TypeInternal
Data ConverterA/D 12x10b
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER
Core Size32-Bit
RAM Size32K x 8
Program Memory Size512KB 512K x 8
ROM (words)524288
PeripheralsDMA, POR, PWM, WDT
Power Supplies3.3/5V
Program Memory TypeFLASH
Has ADCYES
PWM ChannelsYES
DAC ChannelsNO
Supply Voltage-Min (Vsup)3V
Voltage - Supply (Vcc/Vdd)3V~5.5V
DMA ChannelsYES
Bit Size32
Speed64MHz
ConnectivityCANbus, I2C, LINbus, SCI, SPI
Core Processore200z0h
Supply Current-Max140mA
Part StatusActive
PackagingTray
REACH StatusREACH Unaffected
Mounting TypeSurface Mount
Factory Lead Time26 Weeks
Length10mm
CategoriesIntegrated Circuits (ICs)
Terminal FormGULL WING
TechnologyCMOS
Qualification StatusNot Qualified
Terminal PositionQUAD
Package / Case64-LQFP
Terminal Pitch0.5mm
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
Operating Temperature-40°C~125°C TA
ECCN3A991A2
HTS Code8542.31.00.01
ManufacturerSTMicroelectronics
Surface MountYES
Width10mm
Number of Terminations64
Pin Count64
Peak Reflow Temperature (Cel)NOT SPECIFIED
Reflow Temperature-Max (s)NOT SPECIFIED
Supply Voltage3.3V
On Chip Program ROM Width8
Number of I/O45
Clock Frequency16MHz
SeriesAutomotive, AEC-Q100, SPC56
Base Part NumberSPC560B
Additional FeatureALSO OPERATES WITH 5 V NOMINAL SUPPLY
Manufacturer's Part No.SPC560B50L1C6E0X
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
JESD-30 CodeS-PQFP-G64
Height Seated (Max)1.6mm
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing SPC560B50L1C6E0X replacement and equivalent-part options.

What is a cross-reference page for SPC560B50L1C6E0X?

This page groups mapped replacement options for SPC560B50L1C6E0X so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for SPC560B50L1C6E0X?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for SPC560B50L1C6E0X alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to SPC560B50L1C6E0X?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is SPC560B50L1C6E0X obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to SPC560B50L1C6E0X from STMicroelectronics is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.