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Alternative part analysis

MX30LF1G08AA-TI replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MX30LF1G08AA-TI, then verify package, specifications, and application fit before approval.

Compare MX30LF1G08AA-TI against mapped replacement options
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This product currently does not show a published cross-reference list. Use RFQ support if your team needs an alternative part review.

Specification view

Parameter Comparison Chart

A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.

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The left column stays visible so buyers can keep the spec label in view while scanning multiple alternatives.

Parameter Comparison Chart
Current part
Part NumberMX30LF1G08AA-TI
ManufacturerMacronix
CategoryIntegrated Circuits (ICs)
SubcategoryMemory
Package-
SeriesMX30LF
Key Attributes-
DescriptionIC FLASH 1G PARALLEL 48TSOP
Lifecycle-
Stock150,163
Available49,916
Min Order1
DatasheetAvailable
JESD-609 Codee3
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
ECCN Code3A991.B.1.A
HTSUS8542.32.0071
Height Seated (Max)1.2mm
Page Size2Kwords
Power Supplies3/3.3V
Terminal FinishMatte Tin (Sn) - annealed
Supply Voltage-Min (Vsup)2.7V
Voltage - Supply2.7V~3.6V
Supply Current-Max0.03mA
Density1 Gb
Programming Voltage3.3V
Memory Size1Gb 128M x 8
PackagingTray
REACH StatusREACH Unaffected
Lead FreeLead Free
Mounting TypeSurface Mount
Factory Lead Time16 Weeks
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
Published2013
Qualification StatusNot Qualified
Terminal Pitch0.5mm
Operating Temperature-40°C~85°C TA
Part StatusNot For New Designs
Number of Functions1
Reflow Temperature-Max (s)40
MountSurface Mount
Supply Voltage3.3V
Operating Supply Voltage3.6V
Memory TypeNon-Volatile
Number of Terminations48
Number of Pins48
Pin Count48
Width12mm
ECCN3A991B1A
Length18.4mm
HTS Code8542.32.00.51
Memory InterfaceParallel
Sub-CategoriesMemory
Number of Sectors/Size1K
Ready/BusyYES
Command User InterfaceYES
Package / Case48-TFSOP (0.724, 18.40mm Width)
Memory FormatFLASH
Memory Width8
Standby Current-Max0.00005A
ManufacturerMacronix
Sector Size128K
Data PollingNO
Toggle BitNO
Operating ModeSYNCHRONOUS
Write Cycle Time - Word, Page30ns
Organization128MX8
TechnologyFLASH - NAND
Manufacturer's Part No.MX30LF1G08AA-TI
SeriesMX30LF
Access Time (Max)25 ns
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MX30LF1G08AA-TI replacement and equivalent-part options.

What is a cross-reference page for MX30LF1G08AA-TI?

This page groups mapped replacement options for MX30LF1G08AA-TI so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MX30LF1G08AA-TI?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MX30LF1G08AA-TI alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MX30LF1G08AA-TI?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MX30LF1G08AA-TI obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to MX30LF1G08AA-TI from Macronix is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.