What is a cross-reference page for BSP295H6327XTSA1?
This page groups mapped replacement options for BSP295H6327XTSA1 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.
Alternative part analysis
Compare mapped replacement and alternative options for BSP295H6327XTSA1, then verify package, specifications, and application fit before approval.
This product currently does not show a published cross-reference list. Use RFQ support if your team needs an alternative part review.
Specification view
A side-by-side view of the source part and its mapped alternatives so buyers and engineers can screen package, availability, lifecycle, and key descriptors before RFQ.
The left column stays visible so buyers can keep the spec label in view while scanning multiple alternatives.
| Parameter Comparison Chart | Current part BSP295H6327XTSA1 Infineon Technologies |
|---|---|
| Part Number | BSP295H6327XTSA1 |
| Manufacturer | Infineon Technologies |
| Category | Discrete Semiconductor Products |
| Subcategory | Transistors - FETs, MOSFETs - Single |
| Package | SOT223 |
| Series | SIPMOS® |
| Key Attributes | - |
| Description | MOSFET N-CH 60V 1.8A SOT223 |
| Lifecycle | - |
| Stock | 83,719 |
| Available | 83,850 |
| Min Order | 1 |
| Datasheet | Available |
| Part Status | Active |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| Lead Free | Lead Free |
| Mounting Type | Surface Mount |
| Published | 2001 |
| Factory Lead Time | 10 Weeks |
| Halogen Free | Halogen Free |
| Termination | SMD/SMT |
| Packaging | Cut Tape (CT) |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Form | GULL WING |
| Element Configuration | Single |
| Package / Case | TO-261-4, TO-261AA |
| Case Connection | DRAIN |
| Operating Mode | ENHANCEMENT MODE |
| Manufacturer | Infineon Technologies |
| Technology | MOSFET (Metal Oxide) |
| FET Type | N-Channel |
| Sub-Categories | Transistors - FETs, MOSFETs - Single |
| Vgs (Max) | ±20V |
| Categories | Discrete Semiconductor Products |
| Transistor Element Material | SILICON |
| Power Dissipation | 1.5W |
| Operating Temperature | -55°C~150°C TJ |
| Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
| Power Dissipation-Max | 1.8W Ta |
| Series | SIPMOS® |
| Contact Plating | Tin |
| Reflow Temperature-Max (s) | 40 |
| Mount | Surface Mount |
| Pbfree Code | yes |
| Number of Pins | 3 |
| Drain to Source Breakdown Voltage | 60V |
| Gate to Source Voltage (Vgs) | 20V |
| Number of Terminations | 4 |
| Length | 6.5mm |
| Height | 1.6mm |
| Pin Count | 4 |
| Width | 3.5mm |
| Nominal Vgs | 1.1 V |
| Fall Time (Typ) | 19 ns |
| Gate Charge (Qg) (Max) @ Vgs | 17nC @ 10V |
| Continuous Drain Current (ID) | 1.8A |
| Pulsed Drain Current-Max (IDM) | 7.2A |
| Threshold Voltage | 1.1V |
| Manufacturer's Part No. | BSP295H6327XTSA1 |
| Input Capacitance (Ciss) (Max) @ Vds | 368pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 1.8A Ta |
| Drain-source On Resistance-Max | 0.5Ohm |
| Rds On (Max) @ Id, Vgs | 300m Ω @ 1.8A, 10V |
| Vgs(th) (Max) @ Id | 1.8V @ 400μA |
| Number of Elements | 1 |
| Dual Supply Voltage | 60V |
| Turn-Off Delay Time | 27 ns |
| Turn On Delay Time | 5.4 ns |
| Max Dual Supply Voltage | 60V |
| Rise Time | 9.9ns |
| JESD-609 Code | e3 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| RoHS Status | RoHS non-compliant |
| REACH SVHC | No SVHC |
| HTSUS | 8541.29.0095 |
| JESD-30 Code | R-PDSO-G4 |
| ECCN Code | EAR99 |
| Actions |
Cross-reference FAQ
Short answers for teams reviewing BSP295H6327XTSA1 replacement and equivalent-part options.
This page groups mapped replacement options for BSP295H6327XTSA1 so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.
Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.
Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.
Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.
Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.
Engineering support
If your team is unsure whether a mapped alternative to BSP295H6327XTSA1 from Infineon Technologies is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.
Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.
Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.
Surface the electrical, interface, or application-fit questions that still need confirmation before approval.
Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.
