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Alternative part analysis

MSP430F1101AIDGV replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MSP430F1101AIDGV, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
MSP430F1101AIDGV

Texas Instruments

Part NumberMSP430F1101AIDGV
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesMSP430x1xx
Key Attributes-
DescriptionIC MCU 16BIT 1KB FLASH 20TVSOP
Lifecycle-
Stock92,726
Available82,416
Min Order1
DatasheetRequest
Has ADCNO
Integrated CacheNO
DMA ChannelsNO
DAC ChannelsNO
PWM ChannelsYes
Watchdog TimerYes
Low Power ModeYes
Boundary ScanYes
Number of Timers/Counters1
Bit Size16
Number of Programmable I/O14
Program Memory TypeFlash
RAM (bytes)128
Data Bus Width16b
Access Time8 μs
FormatFIXED-POINT
Core ProcessorMSP430
Voltage - Supply (Vcc/Vdd)1.8V~3.6V
Supply Voltage-Max (Vsup)3.6V
Oscillator TypeInternal
Core Size16-Bit
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)
Power Supplies2/3.3V
RAM Size128 x 8
Data ConverterSlope A/D
PeripheralsPOR, WDT
Program Memory Size1KB 1K x 8 + 256B
Memory Size1kB
Part StatusActive
Radiation HardeningNO
Surface MountYes
Pbfree CodeYes
REACH StatusREACH Unaffected
ECCNEAR99
Lead FreeLead Free
PackagingTube
Lifecycle StatusACTIVE (Last Updated: 3 days ago)
Number of Pins20
Number of Terminations20
Pin Count20
Mounting TypeSurface Mount
Length5mm
Number of I/O14
Factory Lead Time6 Weeks
Height1.2mm
CategoriesIntegrated Circuits (ICs)
Terminal PositionDUAL
Peak Reflow Temperature (Cel)260
Terminal FormGULL WING
TechnologyCMOS
ManufacturerTexas
Operating Temperature-40°C~85°C TA
Frequency8MHz
SeriesMSP430x1xx
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
Supply Voltage2.2V
Width4.4mm
Thickness1.05mm
InterfaceUART
Package / Case20-TFSOP (0.173, 4.40mm Width)
Weight60.186038mg
Manufacturer's Part No.MSP430F1101AIDGV
ECCN CodeEAR99
RoHS StatusROHS3 Compliant
REACH SVHCNo SVHC
JESD-609 Codee4
Moisture Sensitivity Level (MSL)2 (1 Year)
HTSUS8542.31.0001
Actions

Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MSP430F1101AIDGV replacement and equivalent-part options.

What is a cross-reference page for MSP430F1101AIDGV?

This page groups mapped replacement options for MSP430F1101AIDGV so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MSP430F1101AIDGV?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MSP430F1101AIDGV alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MSP430F1101AIDGV?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MSP430F1101AIDGV obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

Need help validating the replacement path?

If your team is unsure whether a mapped alternative to MSP430F1101AIDGV from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

Contact a hardware engineer

Email our engineering support contact at [email protected], or use the contact page if the question should be routed across sourcing, engineering, and support.

Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.