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Alternative part analysis

MSP430F2416TZQW replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MSP430F2416TZQW, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
MSP430F2416TZQW

Texas Instruments

Part NumberMSP430F2416TZQW
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesMSP430F2xx
Key Attributes-
DescriptionIC MCU 16BIT 92KB FLASH 113BGA
Lifecycle-
Stock199,804
Available32,641
Min Order1
DatasheetRequest
Integrated CacheNO
DMA ChannelsNO
DAC ChannelsNO
Number of Serial I/Os2
Number of Timers/Counters2
Watchdog TimerYes
Boundary ScanYes
PWM ChannelsYes
Has ADCYes
Low Power ModeYes
RAM (words)4
Bit Size16
Program Memory TypeFlash
Number of A/D Converters8
Supply Voltage-Min (Vsup)3.3V
Data Bus Width16b
FormatFIXED-POINT
Core ProcessorMSP430
Data ConverterA/D 8x12b
Voltage - Supply (Vcc/Vdd)1.8V~3.6V
Supply Voltage-Max (Vsup)3.6V
Oscillator TypeInternal
RAM (bytes)4096
Core Size16-Bit
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
ConnectivityI2C, IrDA, LINbus, SCI, SPI, UART/USART
Program Memory Size92KB 92K x 8 + 256B
Density736 kb
Memory Size92kB
Supply Current-Max0.595mA
RAM Size4K x 8
Part StatusActive
Radiation HardeningNO
PackagingTray
Pbfree CodeYes
REACH StatusREACH Unaffected
ECCNEAR99
Lead FreeLead Free
Lifecycle StatusACTIVE (Last Updated: 3 days ago)
Mounting TypeSurface Mount
MountSurface Mount
Number of I/O64
Factory Lead Time6 Weeks
Terminal PositionBottom
Height1mm
TerminationSMD/SMT
CategoriesIntegrated Circuits (ICs)
Width7mm
Length7mm
Peak Reflow Temperature (Cel)260
TechnologyCMOS
ManufacturerTexas
Terminal Pitch0.5mm
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
SeriesMSP430F2xx
InterfaceI2C, IrDA, LIN, SCI, SPI, UART, USART
Frequency16MHz
Operating Temperature-40°C~105°C TA
Terminal FormBALL
Number of Terminations113
Number of Pins113
Pin Count113
Thickness740μm
Package / Case113-VFBGA
Manufacturer's Part No.MSP430F2416TZQW
RoHS StatusROHS3 Compliant
REACH SVHCNo SVHC
Moisture Sensitivity Level (MSL)3 (168 Hours)
HTSUS8542.31.0001
JESD-609 Codee1
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MSP430F2416TZQW replacement and equivalent-part options.

What is a cross-reference page for MSP430F2416TZQW?

This page groups mapped replacement options for MSP430F2416TZQW so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MSP430F2416TZQW?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MSP430F2416TZQW alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MSP430F2416TZQW?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MSP430F2416TZQW obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

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If your team is unsure whether a mapped alternative to MSP430F2416TZQW from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

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Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.