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Alternative part analysis

MSP430F5419IPZ replacements, alternatives, and cross reference

Compare mapped replacement and alternative options for MSP430F5419IPZ, then verify package, specifications, and application fit before approval.

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Specification view

Parameter Comparison Chart

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Parameter Comparison Chart
Current part
MSP430F5419IPZ

Texas Instruments

Part NumberMSP430F5419IPZ
ManufacturerTexas Instruments
CategoryIntegrated Circuits (ICs)
SubcategoryEmbedded - Microcontrollers
Package-
SeriesMSP430F5xx
Key Attributes-
DescriptionIC MCU 16BIT 128KB FLASH 100LQFP
Lifecycle-
Stock50,995
Available91,726
Min Order1
DatasheetRequest
RoHS StatusROHS3 Compliant
REACH SVHCNo SVHC
JESD-609 Codee4
HTSUS8542.31.0001
Moisture Sensitivity Level (MSL)3 (168 Hours)
Integrated CacheNO
Watchdog TimerYes
Low Power ModeYes
Boundary ScanYes
Has ADCYes
DMA ChannelsYes
Number of I2C Channels4
Number of Timers/Counters3
Number of Serial I/Os3
RAM (words)16
Bit Size16
Number of PWM Channels15
Program Memory TypeFlash
Number of SPI Channels8
Data Bus Width16b
FormatFIXED-POINT
Oscillator TypeInternal
Core Size16-Bit
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Supply Voltage-Min (Vsup)2.2V
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)
ConnectivityI2C, IrDA, LINbus, SCI, SPI, UART/USART
Program Memory Size128KB 128K x 8
Density1 Mb
Memory Size128kB
RAM Size16K x 8
Core ProcessorCPUXV2
Data ConverterA/D 16x12b
Voltage - Supply (Vcc/Vdd)2.2V~3.6V
Supply Current-Max5.56mA
Radiation HardeningNO
PackagingTray
Pbfree CodeYes
REACH StatusREACH Unaffected
ECCNEAR99
Lead FreeLead Free
Number of Pins100
Number of Terminations100
Pin Count100
MountSurface Mount
Mounting TypeSurface Mount
Number of ADC Channels16
Height1.6mm
TerminationSMD/SMT
Width14mm
Length14mm
CategoriesIntegrated Circuits (ICs)
Peak Reflow Temperature (Cel)260
Terminal FormGULL WING
TechnologyCMOS
Thickness1.4mm
ManufacturerTexas
Terminal PositionQUAD
Terminal Pitch0.5mm
Operating Temperature-40°C~85°C TA
Base Part NumberMSP430
Supply Voltage3V
SubcategoryMicrocontrollers
Sub-CategoriesEmbedded - Microcontrollers
InterfaceI2C, IrDA, LIN, SCI, SPI, UART, USART
Weight677.610302mg
Package / Case100-LQFP
Frequency18MHz
Part StatusNot For New Designs
SeriesMSP430F5xx
Number of I/O87
Manufacturer's Part No.MSP430F5419IPZ
Lifecycle StatusNRND (Last Updated: 6 days ago)
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Cross-reference FAQ

Replacement Part Questions

Short answers for teams reviewing MSP430F5419IPZ replacement and equivalent-part options.

What is a cross-reference page for MSP430F5419IPZ?

This page groups mapped replacement options for MSP430F5419IPZ so buyers and engineers can compare alternatives before requesting a quote or approving a substitute.

Does a mapped alternative mean a guaranteed drop-in replacement for MSP430F5419IPZ?

Not automatically. Cross-reference mapping helps shortlist candidates, but package, electrical behavior, qualification scope, and approval rules still need to be checked before release.

Which parameters should teams compare first for MSP430F5419IPZ alternatives?

Start with package, series, key attributes, lifecycle status, stock position, datasheet access, and the mapped pin-to-pin or cross-reference note. Then confirm application-specific requirements in the datasheet and RFQ stage.

Can I request a quote for an alternative to MSP430F5419IPZ?

Yes. Use the product links or RFQ actions on this page to request pricing, availability, documentation, and sourcing support for any listed alternative part.

Is MSP430F5419IPZ obsolete, and what replacement should buyers review first?

Check the lifecycle row on this page first. If buyers need a fast starting point, the strongest mapped replacement currently surfaced here is , followed by the other alternatives shown in the comparison table.

Engineering support

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If your team is unsure whether a mapped alternative to MSP430F5419IPZ from Texas Instruments is really usable, contact us for help on package fit, pin compatibility, key parameter gaps, and qualification-facing review questions.

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Package and pin compatibility

Review whether the alternate path looks credible from package, footprint, and pin-level perspectives.

Parameter and function gaps

Surface the electrical, interface, or application-fit questions that still need confirmation before approval.

Qualification and approval prep

Organize the documentation, datasheet evidence, and validation checkpoints your internal team may still require.